Novel low-cost high-speed optic–electric laser diode pigtail module packaging technology

Abstract

• At present, the research and development of high-speed laser modules for communication are designed with ceramic components globally. • In module packaging without the ceramic part, the misalignment caused by the deformation results in coupling efficiency loss. • A new type of high-speed laser diode pigtail module is designed to change the structure of a laser module and remove ceramic and process parts. • A laser diode pigtail module package achieves the best coupling efficiency. A high-speed laser diode pigtail for wide-band fiber-optic communications is a key component in optical fiber user loop systems, optical fiber data communication systems, and cable television systems. With the advent of a new type of optic–electric high-speed laser, wide-band communication has emerged. These three systems constitute future mainstreams of optical fiber communications. However, high-speed laser diode pigtails used in module components and process assembly account for extremely high production costs. The proposed pigtail module eliminates ceramic parts and facilitates mass production of the components. An optic fiber (including a jacket) was placed into a ferrule sleeve. The optic fiber did not undergo laser damage, and its stability in the reliability test was ensured by the plastic jacket. The optic fiber terminal surfaces grind the 7° angle to enhance the surface quality of the connector, thereby avoiding reflection and incurring a power loss of 4%. Moreover, achieving alignment in a conventional laser module package without a ceramic part and fiber ferrule is a considerable challenge, and apparently, there are still some issues that need to be resolved. In conventional optical fiber module package, laser welding technique provides a superior joint strength. However, in module packaging without the ceramic part, the misalignment caused by the deformation results in coupling efficiency loss. Therefore, a novel design of laser diode pigtail module packaging is necessary. A transmitter optical subassembly device, receiver optical subassembly device, and transceiver pigtail module can be manufactured in a unified process package. By applying the low-cost packaging technique, the cost and fabrication time of the module packaging were reduced, and the fabrication yield was increased.