Abstract
AbstractA novel hybrid analysis method including physical modeling approach is presented for the single complete via structure in this paper. The via structure can be decomposed into two types of different sub‐structures: the interior structure and the exterior structure. The characteristic of the interior structure consisting of the vertical via hole between reference planes is solved using the enhanced quasi‐static method which takes into account the effect of parallel plates. The characteristic of the exterior structure is solved by the improved matrix‐penciled fent method. Then the scattering parameters of the complete via structure can be obtained from the result of the exterior and the interior structure. In order to validate the correctness and the accuracy, the comparison results between the hybrid method and Ansoft's HFSS software are displayed for some microwave multilayer circuits with different layer numbers and different boundary conditions. Copyright © 2011 John Wiley & Sons, Ltd.
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