Abstract
This paper reports that the novel high Tg low dielectric constant polymer with highly rigid coil-shaped main-chain structure was obtained for interlayer dielectric applications in microelectronics. The low dielectric constant of the polymer was induced by it that the coil-shaped main-chain structure with a bulky side-chain out of the main-chain. The coil-shaped structure leads to decrease packing density and increase free volume. The polymer was exhibited low dielectric constant (2.31) without pore. The glass transition temperature of the polymer is higher than 400°C. TGA shows that the polymer was heat stable higher than 350°C under nitrogen now. The elastic modulus of the polymer is 4.3 GPa. The film is able to be prepared with lower temperature (at solvent boiling point). The polymer prepared is novel poly(norbornene imide)s containing bulky fluorinated aryl unit in side-chain. We confirmed that the fluorinated poly(norbornene imide)s displays a coil-shaped a main-chain polymer structure by molecular simulation. The syntheses of the fluorinated poly(norbornene imide)s are described in this paper.
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