Abstract
The investigations applied the original concept of the formation of materials as hybrid gradient composites. Two innovative technologies were used: formation by centrifugal slip casting and sintering with varying proportions of the liquid phase. This allowed us to create a gradient microstructure. This article presents the study of Al2O3-Cu-Mo gradient composites. This work aimed to determine the effect of the metallic phase content on the composite’s microstructure and basic properties. The most critical element of the study will be determining the ability to control the location and flow of the liquid phase during the sintering process. The research demonstrated that adding a third component in the form of Mo reduces the liquid Cu flow onto the surface of the composites during the sintering process. In this research, we achieve results with high cognitive value.Graphic
Highlights
GRADIENT materials are characterized by a continuous change of properties along at least one direction
Pct, 10 vol pct, and 15 vol pct metallic phase, respectively. These results demonstrated that the value of viscosity decreases with the increase of the metallic phase in the slurry
It was found that the highest viscosity value was obtained for the slurry containing 5 vol pct metallic phase
Summary
GRADIENT materials are characterized by a continuous change of properties along at least one direction. Their change of functional and structural properties is effected by variations in parameters, including chemical composition, size, morphology, and structure as a function of position.[1,2,3,4] The gradient bond connecting the components of a given material is often the best type of connection, ensuring optimal composite properties. A smooth transition provides a gentle change of properties that directly reduces the stress in the adjoining area.[5,6] Applications of gradient materials include, among other things, cutting tools, construction materials, and electronic components. Gradient composites can be used as biomedical materials and thermal shields
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