Abstract

Embedded passive technology is an essential technology for further miniaturization and higher performance of electronic package systems. Polymer/ceramic composites have been of great interest as embedded capacitor materials, because they did combine not only the processability of polymers with high dielectric constant of ceramics but also good compatibility with printed circuit boards (PCBs). Novel embedded capacitor films (ECFs) were newly designed for low tolerance embedded capacitor fabrication for organic substrates. In terms of material formulation, ECFs are composed of specially formulated epoxy resin and latent curing agent. And in terms of coating process, a comma roll coating method is used for uniform film thickness in large area. In this paper, it is demonstrated that low tolerance (less than 5%) capacitor can be fabricated using ECFs, and properties of epoxy/BaTiO/sub 3/ composite ECFs are reported. Fabrication process and various properties of ECFs such as dielectric constant, leakage current, adhesion strength, thereto-mechanical characteristics, reliability, and high frequency behavior up to 3 GHz will be presented.

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