Abstract
We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing. ► The novel FIB technique of sample preparation is fast, effective and low-cost. ► It can enhance the process precision to the specific area of the sample. ► It is convenient for analyzing the metallurgy of the microbump in 3DIC packaging. ► The EBSD image quality can be enhanced by just using a common FIB instrument.
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