Abstract
This work reports three innovations in flexible device technology; the use of micro-spring array as the electrical contact components in e-textile, the novel spring cantilever releasing method using air injection and the results of patternable CYTOP and organic conductive polymer using nanoimprinting method. Microspring contact array is realized to compose the electrical circuit through the large area woven textile. The contact resistance of 480 Ω is hold on for over 500 times.
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