Abstract
We present a simulation study and first experimental implementations for a novel polymer three-dimensional waveguide design. The structures described here allow for new concepts of on-chip communication. By using direct laser writing, free-formed polymer structures can be realized directly on the surface of integrated circuits on wafer- or die-level. Further photonic structures like waveguides, resonators, splitters and couplers can be realized with an extended freedom of design to the third dimension. Our approach opens new possibilities for optical interconnects and routing for on-chip signal transmission with a high fill factor and CMOS compatibility.
Highlights
This paper presents a new concept of optical on-chip interconnects and its technology
In order to show the feasibility of 3D laser lithography we fabricate test structures that demonstrate the concept of the waveguide design simulated in the previous chapter
In the previous chapter we simulated a waveguide on continuous bars to form a gap to the substrate and we showed the feasibility of more complex shaped waveguides with periodic pillars, see Figure 3
Summary
This paper presents a new concept of optical on-chip interconnects and its technology. The integration of the optical interconnects is implemented by extensive technological effort like flip-chip mounting [5]. Techniques for the integration of photonic layers have to show CMOS technology compatibility. The threedimensional structuring of polymers in the sub-micrometer range, allows for a new approach of waveguide profile design, with additional degrees of freedom compared to conventional waveguides, which are integrated by planar technology. We present the numerical simulation of complex three-dimensional waveguide structures with finite integration technique (FIT) by CST Microwave Studio [8]. In this approach the model is divided by a hexagonal mesh with mesh cells one order smaller than the simulated wavelength. Polymerization occurs only at the focal point (voxel) by two-photon absorption
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More From: Journal of the European Optical Society-Rapid Publications
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