Abstract

Many advanced applications of glass demand fabrication of engineering parts of utmost dimensional precision which require very accurate grinding and polishing that involves controlled removal of glass. Despite the wealth of literature, however; the mechanism of material removal in glass grinding and polishing is still far from well understood. For instance, it is not known at all to what extent the mechanical properties are compromised inside a scratch groove so as to optimize the machining parameters. Therefore, to develop better understanding about the mechanism of material removal, a series of combined nanoindentation and single pass scratch experiments were conducted on a commercially available soda‐lime‐silica glass as a function of various normal loads (2–20 N) and scratch speeds (0.1–1 mm/s). It was found that the nanohardness and Young's modulus at the local microstructural length scale inside the scratch groove could decrease quite dramatically (~30% to 70%) depending on the combination of load and scratching speed. Further, the tribological properties, the severity and the spatial density of damage evolution were sensitive to the normal loads, scratching speeds, and tensile stresses. Extensive scanning electron microscopy leads to interesting observations on material removal mechanisms. These observations were explained by the theoretical predictions of a model for a brittle, microcracked solid.

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