Abstract

Highly integrated transparent electronic systems are experiencing significant thermal bottlenecks due to the rapid growth of transparent electronics and the lack of suitable transparent thermal management solutions. Therefore, transparent thermal management materials are highly desirable in modern transparent electronics. Based on the phase change properties of polyethylene glycol (PEG) and the encapsulable properties of epoxy resin (EP), we synthesize a biphasically and reversibly transparent PEG/EP composite for thermal energy storage (TPE-TES). Energy-driven structural rearrangements in cross-linked networks are responsible for the high transparency with practical thickness. According to SEM and TEM investigations, PEG and EP achieve submicron phase dispersion, while TPE-TES forms a smooth and continuous surface that suppresses diffuse reflections and contributes to improved visible light penetration. The unique combination of phase change and optical transparency gives TPE-TES the ability to regulate thermal storage, rapid temperature change, and spatial temperature uniformity of transparent electronics. Due to its flexibility, stability, and processability, TPE-TES is also suitable and ideal as thin surface coating films or thick transparent flexible substrates for a wide range of applications in the integration of electronic devices.

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