Novel and Facile Approach to the Fabrication of Metal-Patterned Dielectric Substrates

Abstract

Both native and organic monolayer protected nanometer-sized silver particles were used to metallize patterns printed on glass and polyimide substrates by commercial permanent ink marking pens. The metal particles were selectively fixed onto the inked patterns by direct physical contact; the particles did not adhere to the free substrate surface. The patterns were made highly conductive by sintering or by mechanical buffing. The procedure allows the fabrication of patterned electrical circuits with minimal effort and a resolution of approximately 0.3 mm.