Abstract
Over the last decade, clinical studies show a strong interest for real-time 3D imaging. This calls for ultrasound probes with high-element-count 2D matrix transducer array, interfaced to an imaging system using an in-probe Application Specific Integrated Circuit (ASIC) that takes care of element selection, signal amplification, sub-array beamforming, etc. Since the ASIC is based on silicon and is mounted directly behind the transducer elements, it can be regarded as a rigid plate that can sustain travelling waves, which effectively lead to acoustical cross-talk between the elements. We hypothesize that the cross-talk can be diminished by reducing the thickness of the ASIC and using a proper backing, and we investigate this by simulation.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
