Abstract
This paper analyzes the nonuniform temperature and strain fields resulting from power dissipation in an electronic package. A 208 lead plastic quad flat pack (PQFP) manufactured by Texas Instruments is used to show the temperature distribution and mechanical deformation resulting from power dissipation in the package. The package is tested experimentally and thermally modeled using finite element analysis to obtain the temperature distribution in the active package. The moire interferometry technique is used to acquire displacement contours of an active PQFP and the results are compared to a uniformly heated sample. The results revealed that the thermal loading due to internal power dissipation produces significantly different strains than a uniformly heated sample.
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