Abstract
Non-spherical colloidal particles have shown their great potential in the field of chemical mechanical polishing (CMP) due to their high polishing rate. A new method named “cation induced method” has been developed and used to produce non-spherical colloidal silica particles. We have tested this kind of novel shape particles in the application of SiO2's CMP. The material removal rate of this kind of abrasive particles has been tested and verified to be much faster than traditional spherical silica particles. In addition, both the particles’ morphology and properties have been characterized by the scanning electron microscope (SEM), transmission electron microscope (TEM) and dynamic light scattering (DLS). Finally, a semiquantitative model is built to show the relationship between the shape of particles and the amount of inducing agents.
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