Abstract

By combining the flexibility of MOS logic and the nonvolatility of spintronic devices, Spin-MOS logic and storage circuitries offer a promising approach to implement a highly integrated, power-efficient, and nonvolatile computing and storage systems. Besides the persistent errors due to process variations, however, the functional correctness of Spin-MOS circuitries suffers from additional nonpersistent error that incurred by the randomness of spintronic device operations, i.e., thermal fluctuations. In this work, we quantitatively investigate the impacts of the thermal fluctuations on the operations of two typical Spin-MOS circuitries: one transistor and one magnetic tunnel junction (1T1J) spin-transfer torque random access memory (STT-RAM) cell and a nonvolatile flip-flop design. The possible design techniques to reduce thermal incurred nonpersistent error rate are also discussed. Our experimental results show that the optimization of nonpersistent and persistent errors are closely entangled with each other and should be conducted from both circuit design and magnetic device engineering perspectives simultaneously.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.