Abstract
A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder joints in a ball grid array (BGA) package under temperature cycling. The effects of constraint on printed circuit board (PCB) and stiffness of substrate on the deformation behavior of the solder joints were also studied. A relative damage stress was adopted to analyze the potential failure sites in the solder joints. The results indicated that high inelastic strain and strain energy density were developed in the joints close to the package center. On the other hand, high constraint and high relative damage stress were associated with the joint closest to the edge of the silicon chip which was regarded as the most susceptible failure site if cavitation instability is the dominant failure mechanism. Increasing the external constraint on PCB causes a slight increase in stress triaxiality \( \left( {\sigma _m /\sigma _{eq} } \right) \) and relative damage stress in the joint closest to the edge of the silicon die. The relative damage stress is not sensitive to the Young's modulus of the substrate.
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