Nonisothermal cure kinetics of diglycidylether of bisphenol‐A/amine system reinforced with nanosilica particles

Abstract

AbstractEpoxy‐silica nanocomposites were obtained from directly blending diglycidylether of bisphenol‐A (DGEBA)‐based epoxy and nanoscale silica (NS) and then curing with 4,4′‐diaminodiphenylamine (DDA). The effect of amount of nanosilica (NS) particles as catalyst on the mechanism and kinetic parameters of cure reaction of DGEBA/DDA system was studied. The kinetics parameters were obtained from nonisothermal differential scanning calorimeter (DSC) data using the Kissinger and Ozawa equations. The exothermic peak was shifted toward lower temperatures in DGEBA/DDA/NS system with increasing the amount of nanoslica particles. However, the existence of NS particles with hydroxyl groups in the structure in the mixture of DGEBA/DDA catalyzes the cure reaction and increases the rate constant. The activation energy of cure reaction of DGEBA/DDA system obtained from two methods were in good agreement, and showed a decrease when NS particles were present in the mixture. The mechanism of reaction of DGEBA with DDA was carried out by isothermal curing in the oven at 130°C and measuring the disappearance peak of epoxide group at 916 cm−1 using FTIR. The diffusive behavior of two systems was investigated during water sorption at 25°C and the experimental results fitted well to Fick's law. Diffusion coefficient of cured sample from DGEBA/DDA/10% NS blend decreased in comparison with the sample without NS particles. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 104: 3855–3863, 2007