Abstract
Traditional methods for defect and fault detection in integrated chips have various shortcomings. This study uses terahertz pulse time-domain reflection technology to detect two types of packaged chips with unknown faults and microstrip circuit chips with multiple open circuit faults from different manufacturers. It has achieved qualitative discrimination of internal fault types in packaged chips and precise positioning of fault locations in microstrip circuit wires. When the length of the test line is 27mm, the positioning error is only 1 %. The research results indicate that terahertz pulse time-domain reflection technology has the ability to detect internal faults in integrated chips.
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