Abstract
Vacuum lamination encapsulation is widely adopted to prolong the duration of perovskite solar cells (PSCs) in real operation. However, additional encapsulant along with rigorous processing conditions leads to severe power conversion efficiency (PCE) loss to the corresponding devices. Herein, thermal and optical simulations and experiments are combined, to analyze the mechanisms for device failure during vacuum lamination. Single‐glass encapsulation structure is proposed, which exhibits enhanced thermal conductivity, ensuring thorough and homogeneous melting of the encapsulant during the lamination process. This effectively mitigates delamination within the module and reduces parasitic photocurrent losses in the PSC device after encapsulation. Notably, the single‐glass encapsulation devices retain 88% of their initial PCE after 1000 h damp heat test and successfully pass the thermal cycling standard (IEC 61 215:2016) with 95% retention of initial PCE after 250 cycles.
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