Abstract
In this study, a thick plate with a shallow semi-elliptical surface crack subjected to a transient thermal load was investigated based on the non-Fourier heat conduction law. Using a Laplace transform and its numerical inversion transform methods, the non-Fourier temperature fields and associated thermal stress formulas in the solid uncracking were obtained. Then, using the weight function and analogy methods, the thermal stress intensity factor formula at the crack tip was determined. The effects of the thermal shock time, crack depth, and crack shape on the thermal stress intensity factor and the crack growth behavior were explored numerically by comparing the Fourier model with a non-Fourier model. The results demonstrate that the non-Fourier model is much safer for studying the thermal shock cracking and crack growth behavior of solids under high-temperature applications.
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