Non-Destructive Thin Film Thickness Measurement based on Coplanar Capacitive Sensor and Printed Circuit Board Platform

Abstract

This paper presents a compact design of a coplanar capacitive sensor based on a printed circuit board (PCB) to apply in non-contact and non-destructive thin film thickness measurement. The capacitive sensor design is structured by two coplanar capacitors, including a reference coplanar capacitor and a sensing coplanar capacitor. Using this structure, the thin film thickness could be estimated through the imbalance voltage produced between the two signals from the reference capacitor and sensing capacitor. The size of the proposed sensor is 9.99 × 9.99 mm and the capacitor electrodes structured by shapes of spiral, interdigital, and round are studied and optimized. Those electrode structures have been modelled and simulated and the simulation results reveal that the spiral structure gives the best performance. The experiment was conducted using plastic thin films with thickness ranging from 10 to 230 µm and dielectric constants ranging from 1.375 to 3.19 to investigate the working principle of the sensor. Experiment results show the approximate linearity of the output voltage corresponding to the various thickness at measurement range from 0 to 90 µm. The sensitivity of the sensor is 13.5 and 29 mV/µm corresponding to the 1.375 and 3.19 dielectric constants of the thin films, respectively. The proposed coplanar capacitive sensor is fabricated based on the PCB platform and shows good performance with a minimum cost. The experiment results demonstrate that this sensor has a high potential to be applied in several biomedical and industrial thin film thickness measurement applications.