Non destructive control of flip chip packages for space applications

Abstract

Shrinking dimensions of flip chip assemblies make inspection of bumps or solder joints always more difficult as standard non destructive control techniques reach their resolution limits. This issue is particularly critical for RF flip chip assemblies manufactured at Alcatel Space with stud bumps as small as a few tens of micrometers regarding quality requirements from space industry. In this paper, non destructive control of flip chip packages is addressed by 3D-Electronic Speckles Pattern Interferometry (3D-ESPI). This original non contact and full field technique allows deformation measurements of microsystems with a sub-micron resolution and was successfully applied to detect defaults such as missing bumps in flip chip assemblies.