Abstract
In this work, we discuss the novel concept of using high impedance surfaces (HIS), or electromagnetic band gap structures to address critical electromagnetic noise problems in high-speed circuit, packages, boards, and cavities. We show that the HIS offer significant advantages in a class applications that far exceeds the narrow range of antenna applications. We introduce the concept of cascading HIS of different topologies to provide ultra-wide band suppression for switching noise that is considered a fundamental bottleneck in high-speed printed circuit board design. The S/sub 21/ parameter for a printed circuit board with three different HIS topologies are shown. The use of HIS in mitigation of EMI from circuit boards and in reducing cavity radiation is also demonstrated.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
