Abstract

Reduction in effective work function (EWF) of midgap-tantalum nitride (TaN) metal gate with gadolinium-oxide buffer layer on Hafnium-based high-kappa gate stack has been demonstrated. EWF of 4.2 eV is achieved for TaN with a bilayer arrangement of Gd2O3/HfSiOx dielectric. By using Gd-Si cosputtered layer on HfO2, a reduction in EWF to nMOS compatible value of 4.05 eV is obtained. Electrical and material characterization indicate that the conversion of gadolinium to gadolinium oxide and presence of silicon in the high-kappa layer are responsible for the EWF shift. nMOSFETs with improved output current, transconductance, and channel electron mobility highlight the approach of using gadolinium in the gate stack

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