Nitrogen plasma annealing for low temperature Ta2O5 films

Abstract

A low temperature oxygen/nitrogen plasma process is reported that substantially reduces leakage currents in chemical vapor deposited (CVD) and physical vapor deposited (PVD) films of tantalum oxide. We show that a combination of nitrogen and oxygen in a remote downstream microwave plasma source reduces leakage currents in CVD films of tantalum oxide and also reduces trap densities as measured by charge pumping. The as deposited CVD films show a high level of photoluminescence that is substantially lowered by the plasma anneal due to a reduction in the density of midgap states. For films deposited by PVD in the thickness range of 100 nm we find low leakage currents with a substantial improvement from the introduction of nitrogen into the plasma. However, PVD films in the thickness range of 20 nm show larger relative leakage currents and less of an improvement from the addition of nitrogen. The role of nitrogen in lowering leakage currents and charge trapping is thought to occur from a reduction in the density of bulk trap states in the oxide due to partial incorporation of nitrogen in the oxide. Both of these low temperature deposition and annealing processes are compatible with integration into the upper levels of metallization for high density circuits.