Nitrogen influence on the reflow soldering process optimization

Abstract

The paper presents the results obtained by the authors in order to optimize the reflow soldering process using nitrogen to assure high quality lead free joints between the pins of the SMT electronic devices and the PCB pads. The soldering may be accomplished in air or into a nitrogen atmosphere, this last case being the solution that gives better connections. For practice purposes, since this technology increases the production costs, it is important to be known, at least with a good approximation, the quantity of nitrogen that must be used in the reflow soldering process for a specific situation. Based on experimental result, the paper shows authors recommendations that can be considered further for the production quality and cost optimization.