Abstract
We attempted silicon nitridation that continuously deposits silicon with monosilane (SiH4) and nitrides the silicon with ammonia (NH3) at a low temperature using a vacuum ultraviolet excimer lamp. We used an argon excimer lamp (λ=126 nm, h ν=9.8 eV) so that SiH4 and NH3 can absorb photons and dissociate. Nitrogen exists only near the film surface at a low temperature, and its concentration increases at a high temperature. This photon-assisted process is very feasible for the nitridation of semiconductor devices and flat panel displays in the near future, because it is a low-temperature and low-damage process.
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