Abstract

Thermal processing can affect the properties of smart materials, and the correct selection of the best manufacturing technology is fundamental for producing high tech smart devices, containing embedded functional properties. In this work cutting of thin superelastic Nitinol plates using a femtosecond (fs) and continuous wave (CW) laser was studied. Diamond shaped elements were cut to characterize the kerf qualitative features; microstructural analysis of the cross sections allowed identification of thermal damage characteristics introduced into the material during the laser processes. A thermally undamaged microstructure was observed for fs laser cutting, while CW was seen to be characterized by a large heat-affected zone. Functional properties were investigated by differential scanning calorimetry and tensile testing of laser cut microelements and of the reference material. It was seen that the martensitic transformation behavior of Nitinol is not affected by fs regime, while cw cutting provokes an effect equivalent to a high temperature thermal treatment in the material surrounding the cutting kerf, degradating the material properties. Finally, tensile testing indicated that superelastic performances were guaranteed by fs regime, while strong reduction of the recoverable strain was detected in the CW processed sample.

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