NIST strategies, activities and collaborations in electronics packaging, interconnection and assembly

Abstract

This paper presents a summary of the strategies and activities underway at the National Institute of Standards and Technology (NIST) in electronics packaging, interconnection and assembly (P/I/A). In addition, a sampling of collaborations involving these works is included. The overall NIST effort in P/I/A is composed of targeted programs conducted by the NIST laboratories and by the NIST Advanced Technology Program (ATP). A dominant aspect of the laboratory-based P/I/A program focuses on the metrology and data needed to support the product technologies envisioned within industry roadmaps. A significant aspect of the work includes efforts in metrology, materials, complex material assemblies, and microelectronic components and circuits. In parallel, the NIST ATP is supporting on a cost-share basis a variety of industry-based development projects of high-risk enabling technologies for new or improved products, manufacturing, and processes in P/I/A.