Abstract
Co-fired devices were developed in the late 50’s as a robust option for high power / high temperature electronics. As the name suggest, they were obtained by simultaneously sintering different materials, often an insulating ceramic substrate with a conductive metal on top. Since these devices were first conceived there have been significant developments in processing and sintering technologies. This paper addresses a potential alternative approach to create High temperature Co-fired Ceramics (HTCC’s). Commercially pure nickel and yttria-stabilized zirconia powder layers with a controlled thickness were deposited in graphite dies using Selective Powder Deposition (SPD). These layers were subsequently pre-compacted in the die and consolidated using FAST/SPS sintering. The results show that crack-free laminates of fully dense metal and ceramic layers can be obtained. The metal sections are electrically insulated from one another, demonstrating the possibility to generate conductive tracks/circuits, while using a relatively uncomplicated deposition process and high-speed sintering.
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