Abstract
Considering the importance of electromagnetic shielding fillers in the advanced electromagnetic shielding material and the shortcomings of the current fillers in electrical and magnetic conductivity properties, a facile two-step electroless plating process, including coating nickel layer onto nano-SiO2 followed by coating another Ag layer onto SiO2/Ni obtained, was developed to fabricate electromagnetic shielding fillers in this study. The effects of SiO2 loadings on the thickness, density, magnetic permeability and electric conductivity of as obtained SiO2/Ni/Ag fillers have been investigated completely. The results indicated the thickness of Ni and Ag layer could be finely tuned by changing the content of SiO2 and SiO2/Ni during electroless plating processes. The optimised SiO2/Ni/Ag nanocomposites demonstrate high magnetic permeability and excellent electrical conductivity with 1·60×10−5 H m and 1·82×10−5 Ω m respectively. This method provides a facile and low cost strategy to fabricate nano-fillers for the polymer based electromagnetic shielding composite materials.
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