Abstract
Sputtered Ni and Ti layers were investigated as a diffusion barrier to substitute electroplated Ni between Ti–Si–C and Ti–Si–C–Ag nanocomposite coatings and Cu or CuSn substrates. Samples were subjected to thermal annealing studies by exposure to 400 °C for 11 h. Dense diffusion barrier and coating hindered Cu from diffusing to the surface. This condition was achieved for electroplated Ni in combination with magnetron-sputtered Ti–Si–C and Ti–Si–C–Ag layers deposited at 230 °C and 300 °C, and sputtered Ti or Ni layers in combination with Ti–Si–C–Ag deposited at 300 °C.
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