Abstract
In semiconductor manufacturing, wafer aligners have been widely used, such as the conventional alignment method using a Charge Coupled Device (CCD) transmission sensor to detect the notch or flat in a wafer. This paper presents a proposed vision aligner using a vision method that can be installed in the wafer and plate bonding machine for mass production. The vision system, which uses three cameras to perform wafer alignment of position and rotation, detects wafer face side and ultraviolet (UV) tape on the target wafer and plate. It can be utilized for the alignment process of wafers and ceramic plate bonding. Using the vision method, the aligner could reduce the process steps and time required for wafer bonding, as well as unexpected problems caused by the workers during manufacturing. The system was applied in the mass production field to verify its performance.
Highlights
Measurement and control technology using image information has begun to be used to improve the reliability of image information processing in various industrial fields
To make make more more suitable suitable equipment equipment for for mass mass production, production, the the vision vision aligner aligner should be integrated with the controller, and the mass production process should be inspected by a should should be be integrated integrated with with the the controller, controller, and and the the mass mass production production process process should should be be inspected inspected by by aa worker
Considering the characteristics of such industries, the machine vision technology combining vision technology and machine control technology has the advantage that it can actively respond to various working environments
Summary
Measurement and control technology using image information has begun to be used to improve the reliability of image information processing in various industrial fields. Many kinds of wafer alignment systems use Charge Coupled Device (CCD) sensors to detect the flat surface and/or notch [4] in the wafer and plate, respectively, in the bonding process. A method using an alignment mark on the wafer surface [5] and automatic position correction method based on rigid body transformation was applied in a dicing machine [6], and has been widely applied in the correcting position detection of wafers
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