Abstract
In a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration environment. However, the main drawback of this concept is its inability to mount electronic parts on the PCB surface area occupied by interlaminated layers. For the efficient spatial accommodation of electronics, this paper proposes a new version of a high-damping PCB with multilayered viscoelastic tapes interlaminated on a thin metal stiffener spaced from a PCB. Compared to the previous study, this concept ensures efficient utilization of the PCB area for mounting electronic parts as well as the vibration attenuation capability. Free vibration tests were performed at various temperatures to obtain the basic characteristics of the proposed PCB. The effectiveness of the proposed PCB was verified by random vibration fatigue tests of sample PCBs with various numbers of viscoelastic layers to compare the fatigue life of electronic packages.
Highlights
In recent years, technological trends in various engineering fields such as automotive, defense, aeronautical, and space engineering have been rapidly changing owing to the industrial revolution
The mechanical engineering sector has focused on the minimization of the bulkiness of housing structures to integrate the printed circuit board (PCB) as the housing typically occupies more than 50% of the mass budget of the electronics [5,6]
One of the major failure mechanisms of electronics is the fatigue failure of the solder joint of the electronic package owing to the stress induced by repetitive deflection of the PCB under vibration excitation
Summary
Technological trends in various engineering fields such as automotive, defense, aeronautical, and space engineering have been rapidly changing owing to the industrial revolution. From a mechanical design point of view, a common and simple solution to prevent the vibration-driven failure of the solder joint was the application of a stiffener on the PCB to reduce the dynamic board deflection This structural reinforcement approach is the simplest way to ensure the fatigue life of solder joints; it involves an inevitable increase in the mass and volume of the electronics. Their results of basic characteristic tests and random vibration tests showed that the fatigue life of an electronic package could be increased by more than eight times using the proposed concept Even this concept has a drawback in terms of the spatial accommodation of electronic parts on the PCB because the viscous lamina is attached to the overall surface of the PCB, some areas were opened to provide accessibility to the electronic parts. PCB samples with various numbers of viscous laminas were fabricated and exposed to a random vibration environment to compare the fatigue life of electronic packages
Sign-in/Register to view highlights & summary Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
