New strain measurement method at axial tensile test of thin films through direct imaging

Abstract

This paper proposes a new method for measuring strain during a tensile test of the specimen with micrometre size through direct imaging. A specimen was newly designed for adoption of direct imaging which was the main contribution of the proposed system. The structure of the specimen has eight indicators that make it possible to adopt direct imaging and it is fabricated using the same process of microelectromechanical system (MEMS) devices to guarantee the feasibility of the tensile test. We implemented a system for non-contact in situ measurement of strain with the specimen, the image-based displacement measurement system. Extension of the gauge length in the specimen could be found robustly by computing the positions of the eight rectangular-shape indicators on the image. Also, for an easy setup procedure, the region of interest was found automatically through the analysis of the edge projection profile along the horizontal direction. To gain confidence in the reliability of the system, the tensile test for the Al–3%Ti thin film was performed, which is widely used as a material in MEMS devices. Tensile tests were performed and displacements were measured using the proposed method and also the capacitance type displacement sensor for comparison. It is demonstrated that the new strain measurement system can be effectively used in the tensile test of the specimen at microscale with easy setup and better accuracy.