New polyimide–silica organic–inorganic hybrids

Abstract

AbstractA series of polyimide–silica hybrid films with silica contents up to 30 wt % were successfully prepared by the sol‐gel reaction of tetraethoxysiliane in the presence of poly(amic acid) containing pendent hydroxyl groups. The films were yellow and transparent when the silica content was less than 11 wt %. The chemical structure of the films was characterized by Fourier transform infrared spectroscopy, and the morphology of the films was investigated by scanning electronic microscopy and atomic force microscopy. Thermogravimetric analysis, differential scanning calorimetry, and stress–strain tests were used to measure the performance of the films. The results indicate that the glass‐transition temperatures and decomposition temperatures of the hybrid films increased with increasing silica content, whereas the tensile strength had a maximum with the variety of silica contents. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 2210–2214, 2003