Abstract
The Cu6Sn5 intermetallic, which commonly forms at the solder interconnects, is a critical component contributing to the reliability of solder joints. In this paper, the growth behavior during the isothermal stage of Cu6Sn5 grains in the Sn-xAg/(001)Cu (x = 0, 3, 3.5) joint was investigated. A new phenomenon, the Cu6Sn5 with cellular boundary, is found in the isothermal stage of Sn-3Ag/(001)Cu and Sn-3.5Ag/(001)Cu joint, but not found in the Sn/(001)Cu joint. The result suggests that the Ag3Sn play an important role in the formation of the cellular boundary. High-pressure air blowing was used to uncover the morphology of Cu6Sn5 at the isothermal stage. Scanning electron microscopy and electron backscatter diffraction were employed to characterize the morphology and grain orientation, respectively. The result has a great meaning in understanding the growth of Cu6Sn5 during the isothermal stage and improving the reliability of solder joints.
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