Abstract

In this study, a novel printed circuit board (PCB) strain-based structural design methodology for spaceborne electronics was proposed to compensate for the drawbacks of the conventional Steinberg’s theory. In addition, finite element modeling technique based on strain-based theory, which provides a reliable and rapid solution to structural design of electronics, was investigated. The effectiveness of the proposed methodology was validated through fatigue life tests of sample electronic packages mounted on PCBs with various boundary conditions. These results indicated that the proposed methodology enables more reliable evaluation on the mechanical safety of solder joints as compared with the Steinberg’s theory.

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