Abstract
ISIT proposes a modular glass-silicon wafer integration platform for micro-optical assemblies. Two demonstrators were defined to demonstrate the functionality of the of the wafer level packaging (WLP) platform. The vacuum capping of premanufactured MEMS micromirrors shows the integration with electrical substrate feedthroughs, thin film getters and an optically qualified, dome-shaped glass cover to avoid reflections and to enable a particularly large scanning area. A miniaturised red, green and blue (RGB) laser light source with free-beam optics in a side-looking configuration demonstrates the possibilities of a silicon wafer as an optical bench, which is divided into two parts to allow hermetic optical capping, e.g. of soldered bare-die laser diodes in an inert gas atmosphere, in combination with an open area for the placement of lenses and prisms that are UV-glued there. The lateral beam coupling is realised at wafer level by a moulded glass cap with a very thin exit window. Both demonstrators use thin-wire bonding at wafer level for the electrical contacting of the components.
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