Abstract
Recent developments in microfabrication technologies have produced a portfolio of methods to batch fabricate three-dimensional, micro-scale structures. This has opened the door to new and exciting possibilities in vacuum electronics technology. Application of these modern microfabrication techniques to vacuum electronics now offers new prospects, including: (1) improved device efficiency by replacing thermionic cathodes with micro-fabricated field emitter cathodes, (2) reliable, precise fabrication of miniature millimeter and submillimeter wave circuits, (3) high yields and lower component costs due to batch fabrication, and (4) greater integration which can reduce piece parts assembly, increase yields, and decrease costs.
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