New On-Chip De-Embedding for Accurate Evaluation of Symmetric Devices

Abstract

For the millimeter-wave wireless transceivers, miniaturized on-chip passive devices are employed to increase wireless communication speed. For using miniaturized devices, it is necessary to evaluate test vehicles in advance, in which de-embedding is applied to on-chip evaluation. Although open-short de-embedding is currently most popular, accurate de-embedding is difficult because the ground plane in a short dummy pattern is not ideal in practice. To overcome this problem, we have proposed a new de-embedding method using only a through dummy pattern, called the through-only de-embedding method. By this through-only de-embedding method, we show that a small on-chip inductor with more than 100 pico-henries can be evaluated within 1.18% error.