Abstract
SummaryA review of research work in two fields of metal deposition on dielectric surfaces is presented:(a) Electroless copper and silver deposition using unconventional reducing agents eg cobalt(II) complexes; a comparatively high plating rate is obtained, hydrogen is not evolved in the metal deposition process, and it is possible to regenerate the reducing agent in the plating solution.(b) The direct electroplating of plastics surfaces using a copper sulphide deposit as the conductive layer, which is formed by interaction of the plastics surface with solutions containing copper complexes and a source of sulphide ions. It is possible to electroplate with nickel or copper and obtain a high level of adhesion to the plastics surface.
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