Abstract
Wide band gap (WBG) semiconductors are delivering on the promise of higher power and energy density circuits. In doing so, they are also opening an opportunity for a new generation of dielectric materials. Researchers from the University of Texas at Austin organized a 1.5 day workshop on Next-generation dielectric materials for microelectronics/electrical applications at the Massachusetts Institute Technology on December 4–5, 2019 focusing on this emerging opportunity. The invitation-only workshop brought together the materials researchers with those attempting to improve power electronics (PE) packaging to compare information that would accelerate the field (Figure 1).
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