Abstract
Two ESD clamp circuit design techniques have been developed to reduce cell size and to combat the effects of gate leakage that have become significant in recent generations of digital CMOS process technology. Such clamps have proven to be able to withstand HBM stresses of 6 kV and CDM pulses of 1.2 kV.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
