New Approach In The Properties Evaluation Of Ultrafine-Grained OFHC Copper

Abstract

AbstractIn this study, static, dynamic and tribological properties of ultrafine-grained (UFG) oxygen-free high thermal conductivity (OFHC) copper were investigated in detail. In order to evaluate the mechanical behaviour at different strain rates, OFHC copper was tested using two devices resulting in static and dynamic regimes. Moreover, the copper was subjected to two different processing methods, which made possible to study the influence of structure. The study of strain rate and microstructure was focused on progress in the mechanical properties after tensile tests. It was found that the strain rate is an important parameter affecting mechanical properties of copper. The ultimate tensile strength increased with the strain rate increasing and this effect was more visible at high strain rates$({\dot \varepsilon} \sim 10^2 \;{\rm{s}}^{ - 1} )$. However, the reduction of area had a different progress depending on microstructural features of materials (coarse-grained vs. ultrafine-grained structure) and introduced strain rate conditions during plastic deformation (static vs. dynamic regime). The wear behaviour of copper was investigated through pin-on-disk tests. The wear tracks examination showed that the delamination and the mild oxidational wears are the main wear mechanisms.