Abstract
The 3D Ni/NiO/MoO3/chitosan foam was fabricated and the interfacial barrier of p-n junction was proposed as a driving factor for electrochemical detection of Cu2+. The electrochemical response resulted from the decreased barrier height caused by the absorbed Cu2+. The liner range (0–25 μM) and the lower detection limit (5.69 nM) were obtained. The direct electrochemical detection of Cu2+ in real water sample with excellent stability and recovery was achieved. It affords a new approach to achieve the direct electrochemical detection of metal ions with depressed interference by employing the interfacial effects of p-n junction.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
