Abstract

A study is made of radiation-induced expansion/compaction in Pyrex® (Corning 7740) and Hoya SD-2® glasses, which are used as substrates for MEMS devices. Glass samples were irradiated with a neutron fluence composed primarily of thermal neutrons, and a flotation technique was employed to measure the resulting density changes in the glass. Transport of Ions in Matter (TRIM) calculations were performed to relate fast (∼1MeV) neutron atomic displacement damage to that of boron thermal neutron capture events, and measured density changes in the glass samples were thus proportionally attributed to thermal and fast neutron fluences. Pyrex was shown to compact at a rate of (in Δρ/ρ per n/cm2) 8.14×10−20 (thermal) and 1.79×10−20 (fast). The corresponding results for Hoya SD-2 were 2.21×10−21 and 1.71×10−21, respectively. On a displacement per atom (dpa) basis, the compaction of the Pyrex was an order of magnitude greater than that of the Hoya SD-2. Our results are the first reported measurement of irridiation-induced densification in Hoya SD-2. The compaction of Pyrex agreed with a previous study. Hoya SD-2 is of considerable importance to MEMS, owing to its close thermal expansivity match to silicon from 25 to 500°C.

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