Neighbour-die effect on the measurement of wafer-level flip-chip LED dies in production lines

Abstract

The light from the side surfaces of the test flip-chip light-emitting diode (FCLED) dies is reflected, refracted or absorbed by neighbour dies during the measurement of wafer-level FCLED dies in production lines. A notable measurement deviation is caused by the neighbour-die effect, which is not considered in current industry practice. In this paper, Monte Carlo ray-tracing simulations are used to study the measurement deviations caused by the neighbour-die effect and extension ratios of the film. The simulation results show that the maximal deviation of radiant flux impinging the photodiode can reach 5.5%, if the die is tested without any neighbour dies, or is surrounded by a set of neighbour dies at an extension ratio of 1.1. Moreover, the dependence between the measurement results and neighbour cases for different extension ratios is also investigated. Then, a modified calibration method is proposed and studied. The proposed technique can be used to improve the calibration and measurement accuracy of the test equipment used for measurement of wafer-level FCLED dies in production lines.