Abstract

The instability of p-channel low-temperature polycrystalline silicon thin film transistors (poly-Si TFTs) is investigated under negative gate bias stress (NBS) in this work. Firstly, a series of negative bias stress experiments is performed, the significant degradation behaviors in current–voltage characteristics are observed. As the stress voltage decreases from −25 V to −37 V, the threshold voltage and the sub-threshold swing each show a continuous shift, which is induced by gate oxide trapped charges or interface state. Furthermore, low frequency noise (LFN) values in poly-Si TFTs are measured before and after negative bias stress. The flat-band voltage spectral density is extracted, and the trap concentration located near the Si/SiO2 interface is also calculated. Finally, the degradation mechanism is discussed based on the current–voltage and LFN results in poly-Si TFTs under NBS, finding out that Si–OH bonds may be broken and form Si* and negative charge OH− under negative bias stress, which is demonstrated by the proposed negative charge generation model.

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