Negative charge injection to a positively charged SiO2 hole exposed to plasma etching in a pulsed two-frequency capacitively coupled plasma in CF4/Ar

Abstract

As microchips become smaller, the threat of damage to the device elements of Si semiconductors by charging during plasma etching will become significant. It will be of first importance to establish a plasma-etching technique that does not involve charging, i.e., “charging-free plasma processing.” Here, we utilize the effect of negative charge acceleration under a double layer in order to neutralize the charge inside a microstructure exposed to plasma etching. We have constructed a dual measurement system consisting of an emission in an interface and a contact hole charging on a SiO2 wafer during etching in two-frequency capacitively coupled plasma (2f-CCP) in CF4/Ar and pure Ar. A reduction in charging voltage is measured in the pulsed operation both of the plasma power source and of the wafer bias in the 2f-CCP in electronegative gases, CF4/Ar.